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dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

  • 骰子;色子
    Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
    1. 掷骰子游戏
      Diceis a game which is played using dice.
      1. VERB 把(食物)切成小块;将…切丁
        If youdicefood, you cut it into small cubes.
        1. Dice the onion...
          把洋葱切成丁。
        2. Add the crushed garlic and remaining diced vegetables.
          加入捣碎的大蒜和剩余的蔬菜丁。

      双语例句

      • The Experimental Research of Sapphire Dicing by a UV Laser
        紫外激光划切蓝宝石晶圆的试验研究
      • In OLAP processing, slicing and dicing is often performed along a time axis to analyze trends and find time-based patterns in the data.
        在OLAP的加工,切片和切割往往是演出沿着时间轴来分析发展趋势,并抽出时间为基础的模式中的数据。
      • After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
        通过对半导体加工工艺的分析研究,提出了用磨料水射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。
      • Some have questioned whether the dicing up of mortgages added any value to the economy.
        有人质疑,将按揭贷款分割出售究竟给市场经济增加了什么价值。
      • Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
        砂轮划片机θ向机构和传动误差分析
      • The secondary advantages can include a significant reduction of labor costs, as no post visual inspection is needed as in traditional dicing processes.
        第二大优点包括,降低了人工费用,不需要常规的后续视觉检测。
      • Development of Conductive Photopolymer Resin Bond Dicing Blade
        导电性光固化树脂结合剂锯片的研制
      • Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
        通常情况下,剥离速度和切割速度都是很低的。基于其本身的能力来讲,激光器没有运行在最优化的状态下。
      • A lady doesn't crawl around on the decks dicing with the crew.
        高贵女士可不会和船员们在船的甲板上来回爬。
      • The Technology Study on UV Laser Dicing High Brightness LED Wafer
        高亮度LED晶圆紫外激光划片技术研究